Electronics manufacturer Fujitsu has discovered how to keep silicon chips cool using carbon nanotubes. The company's researchers found it could grow on a silicon wafer a heat-conducting forest of carbon nanotubes, each just 15 micrometers in length, using an iron catalyst. The novel heat sink profile matches the pattern of electrode "bumps" on the base of the chip through which it connects to the motherboard. The nanotube heatsinks were able to efficiently cool high-frequency power amplifier chips of the kind used in mobile phone base-station equipment. The power of such chips are limited by how fast heat can be conducted away to prevent the device melting. The nanotubes could allow the chips to be run even faster without overheating.
Cooling carbon nanotubes